The specification for USB 3.0 was released last November, and now Gennum Corporation has announced an integrated physical layer and controller for USB 3.0. Another three companies, including Synopsys, have demonstrated silicon support for the interface.
Amongst other things, USB 3.0 could be used for transfer of high definition video and audio, given that it has a maximum throughput of 5Gb/s and can deliver up to 300Mb/s of data at the application level. It's also a bidirectional technology, as opposed to USB 2.0 which is unidirectional.
Presuming that the current economic situation doesn't slow things down, hardware utilising USB 3.0 could be available early next year.
(Via EETimes)
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